谐振式压力传感器温度补偿结构的仿真研究
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TP212.1

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Simulation research on temperature compensation structure of resonant pressure sensor
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    摘要:

    温度漂移是影响谐振式传感器精度的重要因素,在精密测量场合,必须进行温度补偿,基于此,提出一种可实现温度补偿的谐振式压力传感器新结构。整体结构为硅-玻璃-金属复合结构,通过3种材料的热膨胀系数匹配实现热应力抵消。硅基底上设有补偿梁,进一步补偿工作梁的温度漂移。为了选择合适的玻璃材料,利用有限元方法研究了玻璃的热膨胀系数和厚度与温度灵敏度的关系,结果表明,采用厚度为1.5 mm的pyrex7740#玻璃时传感器的温度灵敏度最低,该结构能够实现温度补偿,提升传感器精度。

    Abstract:

    Temperature drift is an important factor affecting the accuracy of resonant sensors. Therefore, temperature compensation is essential in precision measurement. Then a new structure of resonant pressure sensor for temperature compensation is proposed.The overall structure includes three layers of silicon-glass-metal, thermal stress can be offset when the thermal expansion coefficients of these three materials satisfy a certain relationship. Moreover,a compensation beam is provided on the silicon substrate to further compensate the temperature drift of the working beam.In order to choose the suitable glass material,finite element method is used to study how the thermal expansion coefficient and thickness affect temperature sensitivity.The results show that the sensor has the lowest temperature sensitivity when using pyrex7740# glass with a thickness of 1.5 mm and the structure does compensate the temperature and improve the accuracy.

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邹梦启,邢维巍,韦祎.谐振式压力传感器温度补偿结构的仿真研究[J].电子测量技术,2019,42(9):74-79

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  • 在线发布日期: 2021-08-23
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