复杂电子装备故障模式及影响分析方法研究
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1.北京航天自动控制研究所北京100854; 2.哈尔滨工业大学自动化测试与控制系哈尔滨150001

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TP2

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Failure mode and effect analysis method for complex electronics system
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1. Beijing Aerospace Automatic Control Institute,Beijing 100854,China; 2. Department of Automatic Test and Control,Harbin Institute of Technology,Harbin 150001,China

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    摘要:

    本文针对复杂电子装备故障诊断实用化过程中存在的故障模式缺乏问题,提出了针对电路不同层次结构的故障模式分析方法。该方法将电路划分为器件层、电路层和系统层3个层次,对于器件层故障模式分析,采用硬件加速应力实验分析其失效模式;对于电路级和系统级故障模式分析,设计并开发了通用型电子装备边界特性测试系统,该系统能够对各类电子设备进行极限边界特性测试,并可获得设备超边界后的故障模式及相应的检测方法。利用本文提出的故障模式分析方法,能够对电子系统各个层次的故障模式进行全面的获取和分析,从而为故障诊断方法实用化进程奠定基础。

    Abstract:

    The practical application of fault diagnosis method is limited because of the lack of accurate failure mode analysis, and in order to solve this problem, a hierarchical analysis framework for failure mode and effect analysis (FMEA) is proposed in this paper. This method divides the FMEA analysis into three levels: the device level, the board level and system level. As to the device level, accelerated stress test method is proposed to analyze the temporal deterministic effect. As to the board level and system level FMEA, a limit test platform is developed. The specification boundary for electronics system can be acquired using this platform, as well as the test method and fault mode. Using the method proposed in this paper, the failure mode of whole electronic system can be acquired, and provide practical application basis for fault diagnosis.

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袁心成,杨智明,俞洋,彭喜元,彭宇,刘旺,张世平.复杂电子装备故障模式及影响分析方法研究[J].电子测量技术,2016,39(4):156-159

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  • 在线发布日期: 2016-05-25
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