An AI-based AOI automatic reassessment method for Chip components
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1. School of Biological Science and Medical Engineering, Southeast University, Nanjing 210096, China; 2. Magic Ray Technology Co., Ltd, Shenzhen 518000, China

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TP23;TP391

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    Abstract:

    SMD components AOI automatic re-judgment can improve the detection of straight-through rate and accuracy, reduce the time and economic costs of manual visual inspection. Chip components as the most commonly used PCB circuit SMD components, its error types are numerous, including solder insufficient, more tin, open solder, horizontal and vertical offset, and the body of the missing parts, wrong parts and other issues. For Chip components, this paper proposes an AI-based AOI re-judgment detection method, including the body and solder positioning, body color or silk screen detection and component soldering detection, each step according to the different needs of the design of the corresponding network model, and the above models were trained and tested. The test results show that the body and solder detection network has a mAP of 0.93 and a detection accuracy of 94.94% under the condition that the IOU threshold is 0.7 and the confidence threshold is 0.6; the average accuracy of the color judgment network is 99.41%; the detection accuracy of the screen-print character detection network is 97.6%; and the accuracy of the welding problem detection network is 92.27%. Finally, the overall process was tested according to the 233 NG data collected and 30,000 OK data, and the overall false alarm rate of the method was 11.2%, with an average run time of 97.5ms per frame, under the premise of ensuring that 233 NG data were not missed. currently, the method has been tried on the production line, and the preliminary results show that the method can effectively reduce the component false alarm rate and reduce the labor cost, which has a good application prospect.

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  • Received:
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  • Online: August 26,2024
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